AI in HPC: Preparing for the Heat Wave With Liquid Cooling

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AI in HPC: Preparing for the Heat Wave With Liquid Cooling

With the influx of consumer generative AI programs like Google’s Bard and OpenAI’s ChatGPT, the generative AI market is poised to explode, growing to $1.3 trillion over the next 10 years from a market size of just $40 billion in 2022, according to a new report by Bloomberg Intelligence (BI).

For high-performance systems, such as HPC and AI, addressing power and cooling needs is essential. The intense heat produced by these systems often challenges conventional cooling methods, potentially restricting the deployment of high-density racks in data centers.

Data centers traditionally used air-cooling equipment to cool their facilities and infrastructure including servers using chilling towers, pumps, Computer Room Air Conditioner (CRAC) units and Computer Room Air Handling (CRAH) units for cooling. However, these solutions no longer meet modern HPC/AI cooling requirements. As a result, there’s a growing imperative to embrace more sophisticated cooling strategies such as Direct Liquid Cooling (DLC).

Companies that want to stay ahead of the curve must take proactive measures to manage this emerging challenge. Here are steps to ensure your organization is ready:

CoolIT Systems (CoolIT) was founded in 2001 and began designing and distributing superior direct liquid cooling products for the desktop gaming industry. As the company grew, so did the need for direct liquid cooling in the data center industry. CoolIT began designing products for datacenters and server OEMs in 2014 and is today the most trusted direct liquid cooling solution in the market. The company headquarters is located in Calgary, Canada and CoolIT has manufacturing warehouses in Canada, Taiwan, and China with sales teams located around the globe.

CoolIT Systems specializes in scalable liquid cooling solutions for the world’s most demanding computing environments. Specifically engineered to manage the intense heat loads produced by AI, this innovation ensures that HPC systems not only function optimally but also enjoy a longer life span. No longer do organizations need to sacrifice performance for sustainability.

CoolIT partners with global leaders in OEM server design to develop the most efficient and reliable liquid cooling solutions for their own leading-edge products. Through its Direct Liquid Cooling technology, CoolIT enables dramatic increases in rack density, component performance and power efficiencies.

CoolIT’s patented DLC™ technology solutions include coolant distribution units (CDUs), coldplates and coldplate loops, secondary fluid network (SFN), rack and chassis manifolds. Coldplates essentially sit on top of the chips. Manifolds are connected directly to the CDU or to an SFN which in turn connects to a CDU. The CDU pumps coolant through the whole system. CoolIT hardware solutions provide dense concentrated liquid cooling to specific server surface areas using warm liquid rather than cold air to dissipate heat from computer and server components.

CoolIT invites you to attend the annual Supercomputing Conference (SC) taking place November 12–17, 2023 in Denver, Colorado. Visit us at SC23, Booth #807. See our latest liquid cooling technology and learn about our partnerships with top server OEMs.

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